data sheet semiconductor http://www.yeashin.com 1 rev.02 20120305 KBPC25005N thru kbpc2510n voltage range 50 to 1000 volts current 25 ampere features ?e low cost ?e this series is ul recognized under component index, file number e127707 ?e high forward surge current capability ?e integrally molded heatsink provide very low thermal resistance. ?e high isolation voltage from case to lugs. ?e high temperature soldering guaranteed: 260 j /10 second, at 5 lbs. (2.3kg) tension. ?e high temperature soldering : 260 o c / 10 seconds at terminals ?e pb free product at available : 99% sn above meet rohs environment substance directive request mechanical data ?e case: molded plastic body, suffic "n" for thinner type ?e terminal: plated 0.25" (6.35mm) lug. ?e polarity: polarity symbols marked on case. ?e mounting: thru hole for #10 scre w, 20 in,- lbs. torqute max. ?e weight: 0.55 ounce, 15.6gram(kbpc25n) maximum ratings and electrical characteristics ?e ratings at 25 j ambient temperature unless otherwise specified ?e single phase, half wave, 60hz, re sistive or inductive load. ?e for capacitive load derate current by 20% symbols kbpc 250 0 5n kbpc 2501n kbpc 2502n kbpc 2504n kbpc 2506n kbpc 2508n kbpc 2510n unit maximum repetitive peak reverse voltage vrrm 50 100 200 400 600 800 1000 volts maximum rms voltage vrms 35 70 140 280 420 560 700 volts maximum dc blocking voltage vdc 50 100 200 400 600 800 1000 volts maximum average forward rectified output current, at tc = 50_ (note 1, 2) i(av) 25 amps peak forward surge current 8.3ms single half sine - wave superimposed on rated load (jedec method ) ifsm 300 amps rating for fusing (t<8.3ms) i2t 373 a2s maximum instantaneous forward voltage drop per bridge element at 12.5a vf 1.1 volts ta = 25 j 10 g a maximum dc reverse current at rate dc blocking voltage per element ta =100 j ir 1.0 ma isolation voltage from case to lugs viso 2500 vac typical thermal resistance (note 1,2) r c jc 2.0 j /w operating temp erature range tj (-65 to +150) storage temperature range tstg (-65 to +150) j 1. unit mounted on 5" x 6" x 4.9" (12.8cm x 15.2cm x 12.4cm)al. finned plate. 2. bolt down on heat-sink with silicon thermal com pound between bridge and mounting sutfae for maximum heat transfer efficiency with # 10 screw. br35n unit: inch(mm)
http://www.yeashin.com 2 rev.02 20120305 KBPC25005N thru kbpc2510n device characteristics 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 single phase half wave 60hz inductive or resistive fig.1-derating curve for fig.3-typical forward characteristics output rectified current per bridge element fig.5-typical junction capacitance instantaneous forward voltage,(v) =50mv f=1mhz revrese voltage,(v) t =25 c instantaneous forward current, junction capacitance,(pf) 0.1 10 sig v 100 1000 0.01 0.1 (a) 1.0 average forward output 10 100 0 0 25 10 load current,(a) 20 30 instantaneous reverse current, average power dissipation of bridge, 0 100 1.0 10 20 average output current, 0 5 10 15 load 25 30 35 60 40 100 80 fig.6-maximum power dissipation 20 (w) 1%duty cycle pulse width=300us j t =25 c 0 0.01 0.1 1.0 t =t capacitive load j j max inductive resistive or percent of rated peak reverse voltage,(%) 40 60 20 120 80 100 t =25 c j 140 forward surge current per element 1 cycle fig.4-typical reverse number of cycles at 60 hz case temperature, ( c) (ua) 10 100 75 50 100 150 125 175 al.finned plate heat sink mounting current, (a) peak forward surge 0 1 100 200 300 t =100 c j characteristics 10 (jedec method) =t 8.3ms single half sine-wave t j max j 100 fig.2-maximum non-repetitive peak 5"x 6"x 4.9" thick (12.8 x 15.2 x 12.4cm) per bridge element per bridge element (a)
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